The 3rd International Conference of Electronic Engineering and Information Science (ICEEIS2016) was held January 4-5, 2016 in Harbin, P.R. China. This conference is sponsored by Harbin University of Science and Technology. The conference continues the excellent tradition of gathering world-class researchers, engineers and educators engaged in the fields of electronic engineering and information science to meet and present their latest activities.
ICEEIS is believed to be the largest technical event on electronic engineering and information science in Harbin in 2016. The focus of the conference is to establish an effective platform for institutions and industries to share ideas and to present the works of scientists, engineers, educators and students from all over the world. The topics covered at ICEEIS2016 include semiconductor materials, nano materials, mechanical materials, MEMS materials, electronic engineering, information science and other topics.
Edition: 1st Edition
ISBN: 1138029874
Posted on: 12/11/2016
Format: Pdf
Page Count: 470 Pages
Author: Dongxing Wang,: --------------------
